The IR-1700 vauum-lift and 2700 edge-grip wafer aligners work seamlessly with IR-820 robot to center and orient notch and flat for regular, semi-clear or clear wafers; from 2" to 12", from 50 microns to 6mm thick wafers, one aligner can accommodate wide range of wafer substrate and applicaitons with none or mimimal change-over.
1700 Vacuum Lift Aligner
- 1 - 2.5 sec alignment time
- Rotation: +/- 0.05 °
- Repeatability: 0.015 °
- Optional thin wafer aligning
- ASCII command protocol
2700 Edge Grip Aligner
- 2 - 3.5 sec alignment time
- Rotation: +/- 0.10 °
- Repeatability: 0.030 °
- 8" or 12"
- ASCII command protocol
- Optional wafer buffering and OCR bracket
IR-2700 is an aligner with a soft touch gripping mechanism that assures constant gripping force despite wafer diameter variation (298 - 302mm) to prevent the stress effect that other products cause.