Easy customization
IR-820 family offers a comprehensive, modular handling solution for all sorts of substrates with a micron-level precision and ISO-class 1 cleanliness. Below is a snapshot of Innovative Robotics' handling capability.
Substrate |
|
|---|---|
SHAPE |
Round, square, rectangle |
SIZE |
2" to 12" (bridge tool available) with notch or flats, with frame |
THICKNESS |
50 μm to 6mm (Thin, Standard to Thick, Very thick) |
MATERIALS |
Silicon, sapphire, quartz, glass, epitaxy, compound semiconductor, wafer divider (paper or plastic) |
CaRRIER |
|
|---|---|
Cassette, boat, magazine, jar, packer, SMIF, FOUP, FOSB |
ID ReADING |
|
|---|---|
Standard, semi-transparent and clear; backside or topside of wafer, OCR, barcode, 2D Matrix |
