For thickness 300 microns to 1.8mm
U-Model 50-0461/50-0481
- Safe-locking to secure wafers during EMO
- Soft touch to prevent particles creations
- Programmable gripping force – 0.5 - 6 N
- Electrically actuated
- Fast gripping – < 0.3 sec
- Light weight – 630 gram
- Suitable for wafers 300 - 1,800 µm thick
- Wafers’ allowed misalignment up to 4mm
- Wafer warpage/sagging up to 0.80 mm
- Accurate wafer placement
Bridge Type 1 (For thickness 600 microns to 2mm)
U-Model 50-0211
- Bridge Type, supports either 6” or 8” wafers
- Safe-locking to secure wafers during EMO
- Soft touch to prevent particles creation
- Programmable griping force – 0.5 - 6 N
- Electrically actuated
- Fast gripping – < 0.3 sec
- Light weight – 630 gram
- Suitable for wafers of standard thickness, down to 200 µm thick
- Wafers’ allowed misalignment up to 4mm
- Wafer warpage/sagging up to 1.25 mm
- Random access to wafers in 8” standard cassette
Bridge Type 2 (For thickness 300 microns to 1mm)
U-Model 50-0221
- Bridge - Bridge Type, supports either 6” or 8” wafers
- Safe-locking to secure wafers during EMO
- Soft touch to prevent particles creations
- Rotatable gripping tip and distal leveling pads
- Programmable griping force – 0.5 - 6 N
- Electrically actuated
- Fast gripping – < 0.3 sec
- Light weight – 630 gram
- Suitable for wafers of standard thickness, down to 200 µm thick
- Wafers’ allowed misalignment up to 4mm
- Wafer warpage/sagging up to 1.0 mm
- Random access to wafers in 6” and 8” standard cassette
