For thickness 50 microns to 1.0mm
U-Model 50-1081
- Fail-safe design for flipping
- Soft touch to prevent particles creation
- Programmable griping force – 0.1 - 1 N
- Through-beam to detect wafer elevation
- Fast gripping – < 0.15 sec
- Light weight – 590 gram
- Suitable for wafer of thickness 80 - 1,000 µm
- Wafers’ allowed misalignment up to 5mm
- Wafer warpage/sagging up to 4.0 mm
- Optional accurate wafer placement ± .010mm
