For thickness 1.8mm to 6.0mm
U-Model 50-0561/50-0581
- Safe-locking to secure wafers during EMO
- Soft touch to prevent particles creations
- Programmable gripping force – 0.5 - 6 N
- Electrically actuated
- Fast gripping – < 0.3 sec
- Light weight – 630 gram
- Suitable for wafers 1.8mm - 6.0mm thick
- Wafers’ allowed misalignment up to 4mm
- Wafer warpage/sagging up to 0.80 mm
- Accurate wafer placement
